Airflow in augmented and/or virtual reality head mounted display device

ABSTRACT

A head mounted display device may include a housing, including a user-facing cavity and an electronics compartment. At least one fan may be installed in the electronics compartment. A plurality of intake ports may be defined in a peripheral wall portion of the user-facing cavity, and at least one air discharge port may be defined in a wall portion of the electronics compartment. A plurality of air channels may extend between the user-facing cavity and the electronics compartment. Operation of the at least one fan may draw external air into the housing through the plurality of air intake ports into the user—facing cavity, and into the electronics compartment through the plurality of air channels, for discharge from the housing through the at least one discharge port, to provide cooling of the user-facing cavity and the electronics compartment.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Nonprovisional of, and claims priority to, U.S.Patent Application No. 62/491,524, filed on Apr. 28, 2017, entitled“AIRFLOW IN AUGMENTED AND/OR VIRTUAL REALITY HEAD MOUNTED DISPLAYDEVICE”, which is incorporated by reference herein in its entirety.

TECHNICAL FIELD

This document relates, generally, to a head mounted display device, andairflow through a head mounted display device.

BACKGROUND

A head mounted display (HMD) device is a type of mobile device which maybe worn by a user, for example, on a head of the user, to experience animmersive augmented reality and/or virtual reality environment. SomeHMDs may be fitted, or seated, against the user's face, surrounding theuser's eyes, so that the physical environment is essentially blocked andnot visible to the user wearing the HMD, to enhance the immersiveexperience for the user.

SUMMARY

In one aspect, a head mounted display device may include a housing; anoptical component assembly installed in the housing; a user-facingcavity defined by a first peripheral portion of the housing and theoptical component assembly installed in the housing; an electronicscompartment defined by a second peripheral portion of the housing andthe optical component assembly installed in the housing; at least onefan installed in the electronics compartment; a plurality of air intakeports defined in a peripheral wall portion of the user-facing cavity; aplurality of air channels connecting the user-facing cavity and theelectronics compartment; and at least one air discharge port defined ina peripheral wall portion of the electronics compartment, at a positioncorresponding to the at least one fan.

In another aspect, a head mounted display device may include a housing;an optical component assembly installed in the housing; a first cavitydefined in the housing, at a first side of the optical componentassembly; a second cavity defined in the housing, at a second side ofthe optical component assembly; at least one air channel connecting thefirst cavity and the second cavity; and a cooling system. The coolingsystem may include at least one fan installed in the second cavity; atleast one heat sink installed in the second cavity, at a positioncorresponding to an exhaust side of the at least one fan; and at leastone heat pipe in thermal contact with at least one electronic componentinstalled in the second cavity, and in thermal contact with the at leastone heat sink, so as to transfer heat absorbed from the at least oneelectronic component to the at least one heat sink.

The details of one or more implementations are set forth in theaccompanying drawings and the description below. Other features will beapparent from the description and drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a user wearing an example HMD, in accordance withimplementations described herein.

FIGS. 2A-2B are perspective views of an example HMD, in accordance withimplementations described herein.

FIG. 3 is a block diagram of an example electronic device, in accordancewith implementations described herein.

FIGS. 4A-4E illustrate an example HMD including a cooling system, inaccordance with implementations described herein.

FIGS. 5A-5B illustrate an electronics compartment of an example HMD, inaccordance with implementations described herein.

FIG. 6 shows an example of a computer device and a mobile computerdevice that can be used to implement the techniques described here.

DETAILED DESCRIPTION

A head mounted display (HMD) device may display image content on adisplay of the HMD to engage a user's visual senses, and may conveyaudio content to the user via an audio output device included in and/orconnected to the HMD to engage the user's auditory senses, to providethe user with an immersive virtual experience. In the example HMD 100shown in FIG. 1, the HMD 100 is fitted, or seated, against the front ofthe head of the user, essentially blocking the ambient physicalenvironment (outside of the HMD 100) from the user's view. Thisarrangement, in which the ambient physical environment is not visible tothe user wearing the HMD 100, may enhance the user's immersive virtualexperience.

In some situations, a temperature and/or a humidity level of an area, orspace, or cavity, between the HMD 100 and the front of the head of theuser, may increase over time, as the HMD 100 remains in place on thehead of the user. Elevation of the temperature and/or the humiditylevels in this user-facing cavity may cause discomfort to the user,and/or may cause fogging in optical components of the HMD 100,obstructing the user's view of the display in the HMD 100, anddetracting from the user's immersive virtual experience. Generation ofheat by electronic components of the HMD 100 may exacerbate thisproblem, and overheating of the electronic components in an electronicscompartment of the HMD 100 may cause the HMD 100 to malfunction.

In an HMD including a cooling system, in accordance with implementationsdescribed herein, one or more fans may draw external ambient air intothe user-facing cavity of the HMD to reduce and/or maintain atemperature in the user-facing cavity and/or to reduce and/or maintain ahumidity level in the user-facing cavity. Continued operation of the oneor more fans may draw air from the user-facing cavity into theelectronic compartment, to cool the electronic components, and/or tocool one or more heat sinks, as the air is discharged from the HMD.

FIGS. 2A and 2B illustrate features of an example HMD 100, such as, forexample, the HMD 100 worn by the user shown in FIG. 1. In particular,FIG. 2A is a front perspective view of the example HMD 100, and FIG. 2Bis a rear view of a housing 110 and an optical component assembly 150 ofthe HMD 100. FIG. 3 is a block diagram of an example electronic device300, and in particular, an example electronic device 300 such as the HMDshown in FIGS. 2A and 2B.

As shown in FIGS. 2A-2B the example HMD 100 may include a housing 110coupled to a frame 120. The housing 110 may include a front portion 110Acoupled to a base portion 110B. A display 140 may be positioned at aninterior facing side of the front portion 110A of the housing 110. Insome implementations, the display 140 may be installed in the housing110 as a dedicated display of the HMD 100. In some implementations, thedisplay 140 may be included in a separate electronic device, such as,for example, a smartphone, that may be removably inserted into andremoved from the housing 110 of the HMD 100.

An optical component assembly 150, including, for example, lensesaligned with the display 140, may be mounted in the housing 110. In someimplementations, the HMD 100 may include a sensing system 160 includingvarious sensors such as, for example, audio sensor(s), image/lightsensor(s), positional sensors (e.g., an inertial measurement unitincluding a gyroscope, an accelerometer, and/or a magnetometer),temperature sensor(s), moisture/humidity sensor(s), and the like. TheHMD 100 may also include a control system 170 and a processor 190controlling various control system devices to facilitate operation ofthe HMD 100. In some implementations, the HMD 100 may include a camera180 to capture still and moving images. In some implementations, the HMD100 may include a gaze tracking device 165 including one or more imagesensors 165A to detect and track an eye gaze of the user, which may beprocessed as a user input.

Audio components 130 may be coupled to the HMD 100, and/or may beincluded in the HMD 100. For example, in some implementations, the HMD100 may include integral audio output devices, or speakers, for example,in the housing 110 of the HMD 100, to direct audio output toward theears of the user when the HMD 100 is worn by the user. In someimplementations, auxiliary audio output devices such as, for example,headphones, earbuds, over the ear headphones and the like may be worn bythe user to output audio content associated with video content displayedto the user on the display 140 of the HMD 100.

A block diagram of an electronic device 300, such as, for example, theexample HMD 100 described above, is shown in FIG. 3. The electronicdevice 300 may include a sensing system 360 and a control system 370,which may be similar to the sensing system 160 and the control system170, respectively, of the example HMD 100 shown in FIGS. 2A and 2B. Theelectronic device 300 may include a cooling system 365, to provide forthermal management of the electronic device 300. The sensing system 360may include, for example, a light sensor, an audio sensor, an imagesensor, a distance/proximity sensor, a positional sensor, a temperatureand/or humidity sensor, and/or other sensors and/or differentcombination(s) of sensors. The control system 370 may include, forexample, a power/pause control device, audio and video control devices,an optical control device, a transition control device, a coolingcontrol device, and/or other such devices and/or differentcombination(s) of devices. The sensing system 360 and/or the controlsystem 370 may include more, or fewer, devices, depending on aparticular implementation, and may have a different physical arrangementthat shown. A processor 390 may be in communication with the sensingsystem 360 and the control system 370, a memory 380, and a communicationmodule 350 may provide for communication between the electronic device300 and one or more external device(s) as discussed above.

When the system is operating to generate and display, for example, avirtual reality environment to the user on the display 140 of the HMD100, the housing 110 of the HMD 100 may be seated against the head, orface, of the user, as shown in FIG. 1. This seating of the HMD 100against the face of the user essentially forms a seal or barrier thatinhibits, or blocks, light from entering the interior confines of thehousing 110 of the HMD 100. While this arrangement may facilitate andenhance the user's immersion in the virtual environment, thisarrangement may also cause the user some discomfort. That is, atemperature level and/or a humidity level in an area within the housing110, between the user's head and the lenses 150 (hereinafter referred toas the user-facing cavity) may increase over time, due to, for example,body heat generated by the user, operation of the electronic componentsof the HMD 100 and the like. In some situations, these elevatedtemperature and/or humidity levels may cause fogging of the lenses 150,which are exposed (e.g., disposed within) to the user-facing cavity,obstructing the user's view of the display 140. This discomfort and/orreduced visibility may detract from the user's experience in theimmersive virtual environment. Additionally, elevated temperatures ofthe electronic components of the HMD 100 over time may not onlyexacerbate this problem, but may also cause malfunction of theelectronic components, thus affecting operation of the HMD 100.

In an HMD, in accordance with implementations described herein, a quiet,lightweight, compact cooling system may provide cooling to both theuser-facing cavity and the electronics compartment, while having littleto no impact on the external profile and/or external appearance of theHMD.

FIGS. 4A-4E are schematic views of an example HMD 100 including acooling system, in accordance with implementations as described herein.FIGS. 4A-4E are not necessarily to scale. Rather, certain aspects of theexample HMD 100 illustrated in FIGS. 4A-4E may be exaggerated, toprovide for clarity in illustration and discussion.

FIG. 4B is a cross sectional view taken along line A-A of FIG. 4A. Asshown in FIGS. 4A and 4B, the example HMD 100 may include a first cavity420, or a user-facing cavity 420, defined between the head, or face, ofthe user and the optical component assembly 150 of the HMD 100. An outerperipheral portion of the user-facing cavity 420 may be defined by theperipheral walls of the base portion 110B of the housing 110. The HMD100 may also include a second cavity 440, or an electronics compartment440, in which electrical components of the HMD 100 such as, for example,the controller, the processor and the like, may be housed. Theelectronics compartment 440 may be defined by the peripheral walls ofthe front portion 110A of the housing and the optical component assembly150. Thus, the optical component assembly 150 may, essentially, separatethe user-facing cavity 420 from the electronics compartment 440.

The HMD 100 may include a cooling system including at least one fan 410installed in the housing 110, for example, in a portion of theelectronics compartment 440, as shown in FIG. 4B. The HMD 100 may alsoinclude a plurality of air intake areas 430 formed in peripheralportions of the housing 110, and a plurality of air channels 450 thatguide air through the HMD 100, as shown in FIG. 4B. In someimplementations, the cooling system may also include at least one heatpipe 470 and/or at least one heat sink 460 (see FIG. 5B) to draw heataway from the electronic components in the electronics compartment 440.The at least one heat sink 460 may also be cooled by the cooling flowgenerated due to the suction force produced by the at least one fan 410as the air is discharged from the HMD 100. The at least one heat pipe470 may be in thermal contact with a corresponding portion of thehousing 110. The thermal contact between the at least one heat pipe 470and the housing 110 may allow the at least one heat pipe 470 to transferheat, or thermal energy, from electronic components in the electronicscompartment 440 to an outside of the housing 110.

In particular, operation of the at least one fan 410 may cause ambientexternal air to be drawn into the user-facing cavity 420 through the airintake areas 430 formed in a peripheral wall portion of the housing 110surrounding the user-facing cavity 420, as illustrated by the arrows A1shown in FIGS. 4A and 4B. This flow of ambient external air through theuser-facing cavity 420 may cool the user-facing cavity 420, and mayreduce a temperature level and/or a humidity level in the user-facingcavity 420, thus reducing or substantially eliminating, for example,fogging of the optical components exposed to the user-facing cavity 420.Continued operation of the at least one fan 410 may cause the air fromthe user-facing cavity 420 to be drawn through the air channels 450,toward the electronics compartment 440. For example, in someimplementations, continued operation of the at least one fan 410 maycause air to be drawn from the user-facing cavity 420 through at leastone first air channel 450A (at a top portion of the HMD 100, between theoptical component assembly 150 and/or the housing 110) and through atleast one second air channel 450B (at a bottom portion of the HMD 100,between the optical component assembly 150 and the housing 110), in thedirection of the arrows A2, and into the electronics compartment 440through at least one third air channel 450C, in the direction of thearrow A3, as shown in FIG. 4B. The air (e.g., cooling air), drawn intothe electronics compartment 440 of the HMD 100 in this manner, may coolelectronic components housed in the electronics compartment 440.Continued operation of the at least one fan 410 may cause cooling air toflow across the electronic components in the electronics compartment 440for cooling, and to be discharged from the HMD 100, for example, in thedirection of the arrow A4, as shown in FIG. 4B.

In some implementations, the plurality of air intake areas 430, or airintake ports 430, may be defined in one of, or some of, or all of, abottom surface 111 and/or a top surface 112, and/or a right lateralsurface 113 and/or a left lateral surface 114 of the base portion 110Bof the housing 110. In some implementations, the air intake areas 430formed in the bottom surface 111 and/or the top surface 112 of thehousing 110 may be larger than the air intake areas 430 formed in theright lateral surface 113 and/or the left lateral surface 114 of thehousing 110. In some implementations, all of the air intake areas 430may be substantially the same size. For example, in someimplementations, all of the air intake areas 430 may have substantiallythe same cross sectional area. In some implementations, the air intakeareas may be a variety of different sizes. In some implementations, theair intake areas 430 may be covered, for example, with a fabric and/or amesh material and/or foam type material, allowing air to pass through,but maintaining some level of opacity to block ambient light fromentering the confines of the housing 110 of the HMD 100.

FIG. 4C is a rear perspective view of the example HMD 100 shown in FIG.4A, with a portion of the base portion 110B of the housing 110 shown indotted lines. FIG. 4D is a rear perspective view of the example HMD 100shown in FIG. 4A, with a portion of the base portion 110B of the housing110 shown in dotted lines, and the optical component assembly 150removed, to further illustrate the positioning of the first airchannel(s) 450A and the second air channel(s) 450B. FIG. 4E is a frontperspective view of the example HMD 100 shown in FIG. 4A, with a portionof the front portion 110A of the housing 110 shown in dotted lines, tofurther illustrate the positioning of the first air channel(s) 450A andthe second air channel(s) 450B leading into the electronics compartment440. In some implementations, two fans 410 may be installed in theelectronics compartment 440, as illustrated in the example shown in FIG.4E. In some implementations, more, or fewer, fans (such as, for example,the fan 410), may be included in the HMD 100 to generate a desiredamount of suction force and corresponding volume of air flow through theHMD 100 as described herein.

In some implementations, the terminal ends of the air channels 450 maybe positioned to guide air in a desired direction in the electronicscompartment 440 in response to the suction force generated by the fan(s)410 and the resulting air flow through the HMD 100. A gap may be formedbetween the terminal end of each of the air channels 450 and a frontsurface 115 of the front portion 110A of the housing 110. This gap mayallow the air to flow across the electronic components, such as, forexample, the controller and/or processor, housed in the electronicscompartment, and to be drawn through the fan(s) 410, for discharge fromthe HMD 100.

FIG. 5A is a front view of the electronics compartment 440 of the HMD100, with the front surface 115 of the front portion 110A of the housing110 removed, so that the cooling system and various exemplary electroniccomponents received within the electronic compartment are visible. FIG.5B is a front view of the electronics compartment 440 of the HMD 100,with the front surface 115 of the front portion 110A of the housing 110removed, and with no electronic components installed, so that thevarious elements of the cooling system are visible. The example coolingsystem shown in FIGS. 5A and 5B includes two fans 410, simply for easeof discussion and illustration. However, as noted above, the coolingsystem may include more, or fewer fans, and/or fans having differentsizes and/or air flow capacities, based on an amount of air to be movedthrough the HMD 100 and/or a desired air flow rate.

As shown in FIG. 5A, a central processing unit (CPU) 500, or processor500, may be installed in the electronics compartment 440. In thisexample, a first fan 410A and a second fan 410B are installed in theelectronics compartment 440, with the processor 500 arranged between thefans 410A, 410B. A first heat sink 460A is aligned with a dischargeportion of the first fan 410A, which is in turn aligned with a firstdischarge area 550A, or first discharge port 550A, defined in the frontportion 110A of the housing 110. A second heat sink 460B is aligned witha discharge portion of the second fan 410B, which is in turn alignedwith a second discharge area 550B, or second discharge port 550B,defined in the front portion 110A of the housing 110.

As shown in FIG. 5B, in some implementations, the processor 500 may bepositioned on a plate 480. The processor 500 may be positioned on theplate 480 so that one or more heat pipes 470, for example, a first heatpipe 470A and a second heat pipe 470B, may absorb heat from theprocessor 500 and draw heat away from the processor 500 to the first andsecond heat sinks 460A, 460B. In some implementations, the first andsecond heat pipes 470A, 470B may be in thermal contact with the housing110. This may allow the heat pipes 470A, 470B to transfer thermalenergy, or heat, from components such as the processor 500 to an outsideof the HMD 100 via the housing 110. This may spread heat out, across arelatively large area of this portion of the HMD 100, allowing naturalconvection and radiation to assist in heat dissipation. This may allowthe system to make use of natural convection and radiation through theexterior surface of the housing 110 for heat dissipation, as well as theforced convection cooling provided by the fan(s) 410.

Accordingly, in an HMD including a cooling system, in accordance withimplementations described herein, operation of one or more fans asdescribed above may provide cooling in the user-facing cavity to inhibitand/or reduce fogging of the optical components and improve usercomfort. In some implementations, operation of one or more fans asdescribed above may also facilitate the cooling of electronic componentsin the electronics compartment through movement of air through theelectronics compartment and cooling of one or more heat sinks as air isdischarged from the one or more fans.

In some implementations, the one or more fans may operate substantiallycontinuously. In some implementations, the one or more fans may operateintermittently, for example, based on a schedule that is set by themanufacturer and/or on a schedule that is set by the user. In someimplementations, the one or more fans may operate based on temperatureand/or humidity levels in the user-facing cavity sensed by temperatureand/or humidity sensors in the HMD, and/or based on temperature levelsassociated with electronic components of the HMD sensed by temperaturesensors associated with the components. For example, operation of theone or more fans may be triggered in response to a sensed temperatureand/or humidity level that is greater than or equal to a thresholdtemperature and/or humidity level. In some implementations, operation ofthe one or more fans may be synchronized with audio content associatedwith the immersive virtual experience. For example, in someimplementations, operation of the one or more fans may be triggered whenacoustic levels associated with the content (audio and visual) presentedto the user by the HMD are greater than or equal to a threshold acousticlevel. In this manner, noise associated with the operation of the one ormore fans may be less perceptible to the user.

Numerous factors such as, for example, noise and vibration generated byoperation of the fan(s) 410, weight, power consumption, space occupiedby the fan(s) 410, and other such factors and/or combinations of factorsmay be taken into consideration in determining a number of fan(s) 410and/or a size and/or a type of fan(s) 410 to be installed in aparticular HMD. Similarly, numerous factors may be taken intoconsideration when determining a number and/or a size and/or a placementof the plurality of air intake areas 430, or air intake ports 430, and anumber and/or a size and/or a placement of the plurality of air channels450. Numerous different combinations of numbers and/or sizing and/orplacement of the air channels 450, numbers and/or sizing and/orplacement of the fan(s) 410, and the like may be varied in differentcombinations to achieve a desired level of air flow performance throughthe HMD 100.

For example, in some implementations, the HMD 100 may include four airchannels 450 providing for air flow from the user-facing cavity 420 tothe electronics compartment 440 as described above. For a fan having agiven airflow capacity, this arrangement may include, for example, twofirst air channels 450A arranged along a top portion of the HMD 100, andtwo second air channels 450 arranged along a bottom portion of the HMD100. In some implementations including four air channels 450, each ofthe air channels 450 may have a width of approximately 20.0 mm, and aheight of approximately 3.0 mm. In some implementations including fourair channels 450, these dimensions may be varied to provide a similarflow of air from the user-facing cavity 420 to the electronicscompartment 440.

In some implementations, the HMD 100 may include two air channels 450providing for air flow from the user-facing cavity 420 to theelectronics compartment 440. For a fan having a given airflow capacity,this arrangement may include, for example, two second air channels 450Barranged along a bottom portion of the HMD 100. In some implementationsincluding two air channels 450, each of the air channels 450 may have awidth of approximately 35.0 mm, and a height of approximately 5.0 mm. Insome implementations including two air channels 450, these dimensionsmay be varied to provide a similar flow of air from the user-facingcavity 420 to the electronics compartment 440.

FIG. 6 shows an example of a computer device 2000 and a mobile computerdevice 2050, which may be used with the techniques described here.Computing device 2000 includes a processor 2002, memory 2004, a storagedevice 2006, a high-speed interface 2008 connecting to memory 2004 andhigh-speed expansion ports 2010, and a low speed interface 2012connecting to low speed bus 2014 and storage device 2006. Each of thecomponents 2002, 2004, 2006, 2008, 2010, and 2012, are interconnectedusing various busses, and may be mounted on a common motherboard or inother manners as appropriate. The processor 2002 can processinstructions for execution within the computing device 2000, includinginstructions stored in the memory 2004 or on the storage device 2006 todisplay graphical information for a GUI on an external input/outputdevice, such as display 2016 coupled to high speed interface 2008. Inother implementations, multiple processors and/or multiple buses may beused, as appropriate, along with multiple memories and types of memory.Also, multiple computing devices 2000 may be connected, with each deviceproviding portions of the necessary operations (e.g., as a server bank,a group of blade servers, or a multi-processor system).

The memory 2004 stores information within the computing device 2000. Inone implementation, the memory 2004 is a volatile memory unit or units.In another implementation, the memory 2004 is a non-volatile memory unitor units. The memory 2004 may also be another form of computer-readablemedium, such as a magnetic or optical disk.

The storage device 2006 is capable of providing mass storage for thecomputing device 2000. In one implementation, the storage device 2006may be or contain a computer-readable medium, such as a floppy diskdevice, a hard disk device, an optical disk device, or a tape device, aflash memory or other similar solid state memory device, or an array ofdevices, including devices in a storage area network or otherconfigurations. A computer program product can be tangibly embodied inan information carrier. The computer program product may also containinstructions that, when executed, perform one or more methods, such asthose described above. The information carrier is a computer- ormachine-readable medium, such as the memory 2004, the storage device2006, or memory on processor 2002.

The high speed controller 2008 manages bandwidth-intensive operationsfor the computing device 2000, while the low speed controller 2012manages lower bandwidth-intensive operations. Such allocation offunctions is exemplary only. In one implementation, the high-speedcontroller 2008 is coupled to memory 2004, display 2016 (e.g., through agraphics processor or accelerator), and to high-speed expansion ports2010, which may accept various expansion cards (not shown). In theimplementation, low-speed controller 2012 is coupled to storage device2006 and low-speed expansion port 2014. The low-speed expansion port,which may include various communication ports (e.g., USB, Bluetooth,Ethernet, wireless Ethernet) may be coupled to one or more input/outputdevices, such as a keyboard, a pointing device, a scanner, or anetworking device such as a switch or router, e.g., through a networkadapter.

The computing device 2000 may be implemented in a number of differentforms, as shown in the figure. For example, it may be implemented as astandard server 2020, or multiple times in a group of such servers. Itmay also be implemented as part of a rack server system 2024. Inaddition, it may be implemented in a personal computer such as a laptopcomputer 2022. Alternatively, components from computing device 2000 maybe combined with other components in a mobile device (not shown), suchas device 2050. Each of such devices may contain one or more ofcomputing device 2000, 2050, and an entire system may be made up ofmultiple computing devices 2000, 2050 communicating with each other.

Computing device 2050 includes a processor 2052, memory 2064, aninput/output device such as a display 2054, a communication interface2066, and a transceiver 2068, among other components. The device 2050may also be provided with a storage device, such as a microdrive orother device, to provide additional storage. Each of the components2050, 2052, 2064, 2054, 2066, and 2068, are interconnected using variousbuses, and several of the components may be mounted on a commonmotherboard or in other manners as appropriate.

The processor 2052 can execute instructions within the computing device2050, including instructions stored in the memory 2064. The processormay be implemented as a chipset of chips that include separate andmultiple analog and digital processors. The processor may provide, forexample, for coordination of the other components of the device 2050,such as control of user interfaces, applications run by device 2050, andwireless communication by device 2050.

Processor 2052 may communicate with a user through control interface2058 and display interface 2056 coupled to a display 2054. The display2054 may be, for example, a TFT LCD (Thin-Film-Transistor Liquid CrystalDisplay) or an OLED (Organic Light Emitting Diode) display, or otherappropriate display technology. The display interface 2056 may compriseappropriate circuitry for driving the display 2054 to present graphicaland other information to a user. The control interface 2058 may receivecommands from a user and convert them for submission to the processor2052. In addition, an external interface 2062 may be provided incommunication with processor 2052, so as to enable near areacommunication of device 2050 with other devices. External interface 2062may provide, for example, for wired communication in someimplementations, or for wireless communication in other implementations,and multiple interfaces may also be used.

The memory 2064 stores information within the computing device 2050. Thememory 2064 can be implemented as one or more of a computer-readablemedium or media, a volatile memory unit or units, or a non-volatilememory unit or units. Expansion memory 2074 may also be provided andconnected to device 2050 through expansion interface 2072, which mayinclude, for example, a SIMM (Single In Line Memory Module) cardinterface. Such expansion memory 2074 may provide extra storage spacefor device 2050, or may also store applications or other information fordevice 2050. Specifically, expansion memory 2074 may includeinstructions to carry out or supplement the processes described above,and may include secure information also. Thus, for example, expansionmemory 2074 may be provided as a security module for device 2050, andmay be programmed with instructions that permit secure use of device2050. In addition, secure applications may be provided via the SIMMcards, along with additional information, such as placing identifyinginformation on the SIMM card in a non-hackable manner.

The memory may include, for example, flash memory and/or NVRAM memory,as discussed below. In one implementation, a computer program product istangibly embodied in an information carrier. The computer programproduct contains instructions that, when executed, perform one or moremethods, such as those described above. The information carrier is acomputer- or machine-readable medium, such as the memory 2064, expansionmemory 2074, or memory on processor 2052, that may be received, forexample, over transceiver 2068 or external interface 2062.

Device 2050 may communicate wirelessly through communication interface2066, which may include digital signal processing circuitry wherenecessary. Communication interface 2066 may provide for communicationsunder various modes or protocols, such as GSM voice calls, SMS, EMS, orMMS messaging, CDMA, TDMA, PDC, WCDMA, CDMA2000, or GPRS, among others.Such communication may occur, for example, through radio-frequencytransceiver 2068. In addition, short-range communication may occur, suchas using a Bluetooth, Wi-Fi, or other such transceiver (not shown). Inaddition, GPS (Global Positioning System) receiver module 2070 mayprovide additional navigation- and location-related wireless data todevice 2050, which may be used as appropriate by applications running ondevice 2050.

Device 2050 may also communicate audibly using audio codec 2060, whichmay receive spoken information from a user and convert it to usabledigital information. Audio codec 2060 may likewise generate audiblesound for a user, such as through a speaker, e.g., in a handset ofdevice 2050. Such sound may include sound from voice telephone calls,may include recorded sound (e.g., voice messages, music files, etc.) andmay also include sound generated by applications operating on device2050.

The computing device 2050 may be implemented in a number of differentforms, as shown in the figure. For example, it may be implemented as acellular telephone 2080. It may also be implemented as part of a smartphone 2082, personal digital assistant, or other similar mobile device.

Various implementations of the systems and techniques described here canbe reali20ed in digital electronic circuitry, integrated circuitry,specially designed ASICs (application specific integrated circuits),computer hardware, firmware, software, and/or combinations thereof.These various implementations can include implementation in one or morecomputer programs that are executable and/or interpretable on aprogrammable system including at least one programmable processor, whichmay be special or general purpose, coupled to receive data andinstructions from, and to transmit data and instructions to, a storagesystem, at least one input device, and at least one output device.

These computer programs (also known as programs, software, softwareapplications or code) include machine instructions for a programmableprocessor, and can be implemented in a high-level procedural and/orobject-oriented programming language, and/or in assembly/machinelanguage. As used herein, the terms “machine-readable medium”“computer-readable medium” refers to any computer program product,apparatus and/or device (e.g., magnetic discs, optical disks, memory,Programmable Logic Devices (PLDs)) used to provide machine instructionsand/or data to a programmable processor, including a machine-readablemedium that receives machine instructions as a machine-readable signal.The term “machine-readable signal” refers to any signal used to providemachine instructions and/or data to a programmable processor.

To provide for interaction with a user, the systems and techniquesdescribed here can be implemented on a computer having a display device(e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor)for displaying information to the user and a keyboard and a pointingdevice (e.g., a mouse or a trackball) by which the user can provideinput to the computer. Other kinds of devices can be used to provide forinteraction with a user as well; for example, feedback provided to theuser can be any form of sensory feedback (e.g., visual feedback,auditory feedback, or tactile feedback); and input from the user can bereceived in any form, including acoustic, speech, or tactile input.

The systems and techniques described here can be implemented in acomputing system that includes a back end component (e.g., as a dataserver), or that includes a middleware component (e.g., an applicationserver), or that includes a front end component (e.g., a client computerhaving a graphical user interface or a Web browser through which a usercan interact with an implementation of the systems and techniquesdescribed here), or any combination of such back end, middleware, orfront end components. The components of the system can be interconnectedby any form or medium of digital data communication (e.g., acommunication network). Examples of communication networks include alocal area network (“LAN”), a wide area network (“WAN”), and theInternet.

The computing system can include clients and servers. A client andserver are generally remote from each other and typically interactthrough a communication network. The relationship of client and serverarises by virtue of computer programs running on the respectivecomputers and having a client-server relationship to each other.

In some implementations, the computing devices depicted in FIG. 6 caninclude sensors that interface with a virtual reality (VR headset/HMDdevice 2090). For example, one or more sensors included on a computingdevice 2050 or other computing device depicted in FIG. 6, can provideinput to VR headset 2090 or in general, provide input to a VR space. Thesensors can include, but are not limited to, a touchscreen,accelerometers, gyroscopes, pressure sensors, biometric sensors,temperature sensors, humidity sensors, and ambient light sensors. Thecomputing device 2050 can use the sensors to determine an absoluteposition and/or a detected rotation of the computing device in the VRspace that can then be used as input to the VR space. For example, thecomputing device 2050 may be incorporated into the VR space as a virtualobject, such as a controller, a laser pointer, a keyboard, a weapon,etc. Positioning of the computing device/virtual object by the user whenincorporated into the VR space can allow the user to position thecomputing device so as to view the virtual object in certain manners inthe VR space. For example, if the virtual object represents a laserpointer, the user can manipulate the computing device as if it were anactual laser pointer. The user can move the computing device left andright, up and down, in a circle, etc., and use the device in a similarfashion to using a laser pointer.

In some implementations, one or more input devices included on, orconnect to, the computing device 2050 can be used as input to the VRspace. The input devices can include, but are not limited to, atouchscreen, a keyboard, one or more buttons, a trackpad, a touchpad, apointing device, a mouse, a trackball, a joystick, a camera, amicrophone, earphones or buds with input functionality, a gamingcontroller, or other connectable input device. A user interacting withan input device included on the computing device 2050 when the computingdevice is incorporated into the VR space can cause a particular actionto occur in the VR space.

In some implementations, a touchscreen of the computing device 2050 canbe rendered as a touchpad in VR space. A user can interact with thetouchscreen of the computing device 2050. The interactions are rendered,in VR headset 2090 for example, as movements on the rendered touchpad inthe VR space. The rendered movements can control virtual objects in theVR space.

In some implementations, one or more output devices included on thecomputing device 2050 can provide output and/or feedback to a user ofthe VR headset 2090 in the VR space. The output and feedback can bevisual, tactical, or audio. The output and/or feedback can include, butis not limited to, vibrations, turning on and off or blinking and/orflashing of one or more lights or strobes, sounding an alarm, playing achime, playing a song, and playing of an audio file. The output devicescan include, but are not limited to, vibration motors, vibration coils,piezoelectric devices, electrostatic devices, light emitting diodes(LEDs), strobes, and speakers.

In some implementations, the computing device 2050 may appear as anotherobject in a computer-generated, 3D environment. Interactions by the userwith the computing device 2050 (e.g., rotating, shaking, touching atouchscreen, swiping a finger across a touch screen) can be interpretedas interactions with the object in the VR space. In the example of thelaser pointer in a VR space, the computing device 2050 appears as avirtual laser pointer in the computer-generated, 3D environment. As theuser manipulates the computing device 2050, the user in the VR spacesees movement of the laser pointer. The user receives feedback frominteractions with the computing device 2050 in the VR environment on thecomputing device 2050 or on the VR headset 2090.

In some implementations, a computing device 2050 may include atouchscreen. For example, a user can interact with the touchscreen in aparticular manner that can mimic what happens on the touchscreen withwhat happens in the VR space. For example, a user may use apinching-type motion to zoom content displayed on the touchscreen. Thispinching-type motion on the touchscreen can cause information providedin the VR space to be zoomed. In another example, the computing devicemay be rendered as a virtual book in a computer-generated, 3Denvironment. In the VR space, the pages of the book can be displayed inthe VR space and the swiping of a finger of the user across thetouchscreen can be interpreted as turning/flipping a page of the virtualbook. As each page is turned/flipped, in addition to seeing the pagecontents change, the user may be provided with audio feedback, such asthe sound of the turning of a page in a book.

In some implementations, one or more input devices in addition to thecomputing device (e.g., a mouse, a keyboard) can be rendered in acomputer-generated, 3D environment. The rendered input devices (e.g.,the rendered mouse, the rendered keyboard) can be used as rendered inthe VR space to control objects in the VR space.

Computing device 2000 is intended to represent various forms of digitalcomputers and devices, including, but not limited to laptops, desktops,workstations, personal digital assistants, servers, blade servers,mainframes, and other appropriate computers. Computing device 2050 isintended to represent various forms of mobile devices, such as personaldigital assistants, cellular telephones, smart phones, and other similarcomputing devices. The components shown here, their connections andrelationships, and their functions, are meant to be exemplary only, andare not meant to limit implementations of the inventions describedand/or claimed in this document.

A number of embodiments have been described. Nevertheless, it will beunderstood that various modifications may be made without departing fromthe spirit and scope of the specification.

In addition, the logic flows depicted in the figures do not require theparticular order shown, or sequential order, to achieve desirableresults. In addition, other steps may be provided, or steps may beeliminated, from the described flows, and other components may be addedto, or removed from, the described systems. Accordingly, otherembodiments are within the scope of the following claims.

What is claimed is:
 1. A head mounted display device, comprising: ahousing; an optical component assembly installed at an intermediateportion of the housing; a first cavity defined by a first peripheralportion of the housing and a first side portion of the optical componentassembly installed in the housing, wherein the first cavity is a userfacing cavity configured to interface with a head of a user; a secondcavity defined by a second peripheral portion of the housing and asecond side portion of the optical component assembly opposite thesecond side portion thereof, wherein the second cavity is configured toreceive at least one electronic component therein; at least one faninstalled in the second cavity; a plurality of air intake ports definedin a peripheral wall portion of the first cavity; a plurality of airchannels connecting the first cavity and the second cavity; and at leastone air discharge port defined in a peripheral wall portion of thesecond cavity, at a position corresponding to the at least one fan. 2.The device of claim 1, wherein a suction force generated by the at leastone fan draws air into the first cavity through the plurality of airintake ports, and draws air from the first cavity into the second cavitythrough the plurality of air channels.
 3. The device of claim 2, whereinthe at least one fan is configured to discharge air from the secondcavity out of the housing through the at least one discharge port. 4.The device of claim 3, further comprising: at least one heat pipe inthermal communication with at least one electronic component in thesecond cavity; and at least one heat sink in thermal communication withthe at least one heat pipe.
 5. The device of claim 4, wherein the atleast one heat sink is positioned between an exhaust portion of the atleast one fan and the at least one discharge port, such that airdischarged by the at least one fan is directed across the at least oneheat sink prior to discharge from the housing through the at least onedischarge port.
 6. The device of claim 4, wherein the at least one heatpipe is in thermal contact with a portion of the housing so as totransfer thermal energy, absorbed by the at least one heat pipe from theat least one electronic component, to an outside of the housing.
 7. Thedevice of claim 1, wherein the plurality of air channels includes: atleast one first air channel extending through an upper portion of theoptical component assembly to provide for air flow communication betweenan upper portion of the first cavity and an upper portion of the secondcavity; and at least one second air channel extending through a lowerportion of the optical component assembly to provide for air flowcommunication between a lower portion of the first cavity and a lowerportion of the second cavity.
 8. The device of claim 7, wherein aterminal end of the at least one first air channel is positioned abovethe at least one fan in the second cavity, and a terminal end of the atleast one second air channel is positioned below the at least one fan inthe second cavity.
 9. The device of claim 1, wherein, in a first mode,the at least one fan is configured to operate continuously when the headmounted display device is in an on-state, and in a second mode, the atleast one fan is configured to operate in response to a detectedtemperature in the head mounted display device that is greater than athreshold temperature, and to suspend operation the detected temperatureis less than or equal to the threshold temperature.
 10. The device ofclaim 9, wherein the first cavity is a user-facing cavity, and thedetected temperature is a temperature in the user-facing cavity.
 11. Thedevice of claim 9, wherein the second cavity is an electronicscompartment, and the detected temperature is a temperature in theelectronics compartment, or a temperature of one or more electroniccomponents installed in the electronics compartment.
 12. The device ofclaim 9, wherein, in a third mode, the at least one fan is configured tooperate when an audio output level associated with content output by thehead mounted display device is greater than or equal to a thresholdaudio output level.
 13. A head mounted display device, comprising: ahousing; an optical component assembly installed in the housing; a firstcavity mounted on a user's head and defined in the housing, at a firstside of the optical component assembly, wherein the first cavity is auser facing cavity configured to interface with a head of a user; asecond cavity defined in the housing, at a second side of the opticalcomponent assembly opposite the first side thereof, wherein the secondcavity is configured to receive at least one electronic componenttherein; at least one air channel connecting the first cavity and thesecond cavity; at least one electronic component installed in the secondcavity; and a cooling system, including: at least one fan installed inthe second cavity; at least one heat sink installed in the secondcavity, at a position corresponding to an exhaust side of the at leastone fan; and at least one heat pipe in thermal contact with the at leastone electronic component installed in the second cavity, and in thermalcontact with the at least one heat sink, so as to transfer heat absorbedfrom the at least one electronic component to the at least one heatsink.
 14. The device of claim 13, further comprising: at least one airintake port defined in a peripheral wall portion of the first cavity,wherein the at least one fan is configured to generate a suction forcethat draws air from the first cavity into the second cavity through theat least one air channel.
 15. The device of claim 14, furthercomprising: at least one air discharge port defined in a peripheral wallportion of the second cavity, at a position corresponding to the exhaustside of the at least one fan, wherein the fan is configured to draw airfrom the second cavity into a suction side of the fan, and to dischargeair from the fan through a discharge side of the fan and across the atleast one heat sink, so as to discharge the air through the at least oneair discharge port.
 16. The device of claim 13, wherein, in a firstmode, the at least one fan is configured to operate continuously whenthe head mounted display device is in an on-state, and in a second mode,the at least one fan is configured to operate in response to a detectedtemperature in the head mounted display device that is greater than athreshold temperature, and to suspend operation the detected temperatureis less than or equal to the threshold temperature.
 17. The device ofclaim 16, wherein the first cavity is a user facing cavity, and thedetected temperature is a temperature in the first cavity of thehousing.
 18. The device of claim 16, wherein the second cavity is anelectronics compartment, and the detected temperature is a temperaturein the second cavity of the housing, or a temperature of one or moreelectronic components installed in the second cavity of the housing. 19.The device of claim 13, wherein, in a third mode, the at least one fanis configured to operate when an audio output level associated withcontent output by the head mounted display device is greater than orequal to a threshold audio output level.
 20. The device of claim 1,wherein the first cavity is a user-facing cavity, and the second cavityis an electronics compartment.